: Flux residues, salt, perspiration, and plating chemistries. In the presence of moisture, these split into conductive ions, triggering electrochemical migration (ECM) and parasitic leakage currents.
If you find an old "IPC-CH-65 PDF" online, it is likely outdated. Seek the IPC-CH-65B PDF or the latest IPC-CH-65-CN for current best practices. ipc-ch-65 pdf
It consolidates industry knowledge on cleaning processes, including the types of contaminants (like flux residues), cleaning chemistry, and matching cleaning methods to specific assembly types. Key PDF Resources : Flux residues, salt, perspiration, and plating chemistries
[Component Supplier] ──> [Proper Packaging] ──> [Incoming Inspection] ──> [Assembly Line] (Clean Washing) (ESD & Moisture) (ROSE / IC Testing) (Controlled Environment) Steps for Implementation : Flux residues